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FFKM O-Rings and Seals for Semiconductor Industry

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Groove design specifications for high-pressure FFKM O-ring applications require careful calculation of dimensions and clearances. Groove depth determines O-ring compression or squeeze, typically 10 to 30 percent of cross-section diameter. Width accommodates O-ring expansion under pressure. Extrusion gaps must be minimized, generally not exceeding 0.003 to 0.005 inches depending on pre... https://globalsealstech.com/ffkm-seals/

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